| 一种用于功率模块热分布特性研究的精确模型 |
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| 引用本文： | 耿莉,陈治明,R.Kruemmer,T.Reimann,J.Petzoldt.一种用于功率模块热分布特性研究的精确模型[J].半导体学报,2001,22(5). |
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| 作者姓名： | 耿莉 陈治明 R.Kruemmer T.Reimann J.Petzoldt |
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| 作者单位： | 1. 西安理工大学应用电子学系,
2. Department of Electronics,Technical University of Ilmenau, |
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| 摘 要： | 应用有限元法，对一个IGBT功率模块的三维热分布进行了仿真研究，提出了通过ANSYS仿真建立热模型的基本方法，进而探讨了功率模块上各芯片之间的热耦合关系，提出了考虑热耦合效应在内的功率模块热模型的统一结构，基于对瞬态热阻抗曲线的拟合，获得了热模型的相关参数，从而建立了热耦合模型.该模型可方便地应用于电路仿真软件如PSPICE中，仿真结果与有限元计算结果一致，并与实际测量值相符.
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| 关 键 词： | 功率电子 IGBT模块 热仿真 热耦合 |
A Precise Model for Simulation of Temperature Distribution in Power Modules |
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| GENG Li,CHEN Zhi-ming,R.Kruemmer,T.Reimann,J.Petzoldt.A Precise Model for Simulation of Temperature Distribution in Power Modules[J].Chinese Journal of Semiconductors,2001,22(5). |
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| Authors: | GENG Li CHEN Zhi-ming RKruemmer TReimann JPetzoldt |
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| Abstract: | The interaction between the active chips mounted and the same base plate is considered as a thermoelectrical coupling effect.An approach to coupling effect analysis of a multi-chip system is presented with IGBT as a sample.Finite element method is used to evaluate the temperature distribution in power modules.The precise electrothermal model is obtained by fitting the curve of transient thermal impedance with a finite series of exponential terms,in which,the thermal-coupling effect among chips is considered as a prediction of the highest transient temperature of the chips.This model can be used in many thermal monitoring systems.Both ANSYS and PSPICE si-mulation software have been employed，and the simulation results agree with the experimental ones very well. |
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