Development of a chipscale integrated microelectrode/microelectronic device for brain implantable neuroengineering applications |
| |
Authors: | Yoon-Kyu Song Patterson W.R. Bull C.W. Beals J. Naejye Hwang Deangelis A.P. Lay C. McKay J.L. Nurmikko A.V. Fellows M.R. Simeral J.D. Donoghue J.P. Connors B.W. |
| |
Affiliation: | Div. of Eng., Brown Univ., Providence, RI, USA; |
| |
Abstract: | An ultralow power analog CMOS chip and a silicon based microelectrode array have been fully integrated to a microminiaturized "neuroport" for brain implantable neuroengineering applications. The CMOS integrated circuit (IC) includes preamplifier and multiplexing circuitry, and a hybrid flip-chip bonding technique was developed to fabricate a functional, encapsulated microminiaturized neuroprobe device. Our neuroport has been evaluated using various methods, including pseudospike detection and local excitation measurement, and showed suitable characteristics for recording neural activities. As a proof-of-concept demonstration, we have measured local field potentials from thalamocortical brain slices of rats, suggesting that the new neuroport can form a prime platform for the development of a microminiaturized neural interface to the brain in a single implantable unit. An alternative power delivery scheme using photovoltaic power converter, and an encapsulation strategy for chronic implantation are also discussed. |
| |
Keywords: | |
|
|