新型L形梁压阻微加速度传感器

介绍了一种新型的基于MEMS体硅加工工艺的L形粱压阻微加速度传感器.在加工过程中采用Si-Si直接键合完成底板与传感器支撑框体之间的粘合,使得后续加工工艺更加简单;采用DRIE释放梁结构,从而保证了梁结构的完整性.分析了该传感器的结构参数和灵敏度,并用ANSYS进行了有限元模拟,同时介绍了其工艺流程,以及封装后的测试结果.芯片尺寸为3.8 mm×3.8 mm×0.82 mm,其中敏感质量块尺寸为2 mm×2 mm×0.4 mm,梁尺寸为2 200μm×100 μm×40μm.经初步测试,在采用5 V电源供电时灵敏度为0.5 mV/g左右,3 dB截止频率为520 Hz左右.

Novel Piezoresistive Accelerometer with L-Shaped Spring Legs

A novel MEMS piezoresistive accelerometer with L-shaped spring legs was presented. Si fusion bonding technology was used to bond the two wafers together, and DRIE was used to release the beams, both of them make the process more easy. The analysis of the parameters such as sensitivity of the accelerometer was introduced. The simulation was made using ANSYS, and it is compared with the measuring results. The chip area is 3.8 mm×3.8 mm × 0.82 mm, and the mass circuit is 2 mm × 2 mm× 0.4 mm, and the L-shaped spring is 2 200 μm × 100 μm × 40 μm. The sensitivity of the accelerometer is about 0.5 mV/g under the condition of power supply 5 V, and the 3 dB frequency is about 520 Hz.