Thermal Properties Measurement of Micro-electromechanical System Sensors by Digital Moire Method |
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Authors: | H. Shang,H. Xie,X. Wang,S. Jiang,F. Dai,W. Wang&dagger ,Y. Fang&dagger ,Y. Zhao&Dagger |
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Affiliation: | Department of Engineering Mechanics, Tsinghua University, Beijing, 100084, China; Beijing Key Lab for Nano-photonics and Nano-structure, 100037 Beijing, China; LNM, Institute of Mechanics, Chinese Academic of Science, 100080, Beijing, China |
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Abstract: | Abstract: The thermal properties of a micro-electromechanical system sensor were analysed by a novel digital moiré method. A double-layer micro-cantilever sensor (60 μ m long, 10 μ m width and 2 μ m thick) was prepared by focused ion beam milling. A grating with frequency of 5000 lines mm−1 was etched on the cantilever. The sensor was placed into a scanning electron microscope system with a high temperature device. The observation and recording of the thermal deformation of the grating were realised in real-time as the temperature rose from room temperature to 300 °C at intervals of 50 °C. Digital moiré was generated by interference of the deformed grating and a digital virtual grating. The thermal properties including strain distribution of the sensor and the linear expansion coefficient of polysilicon were accurately measured by the phase-shifted moiré patterns. |
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Keywords: | digital moiré double-layer micro-cantilever grating linear expansion coefficient strain |
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