IGBT结温获取方法及其讨论*

IGBT模块的寿命预测研究与可靠性分析等都与结温有密切的关系,因此研究结温的获取方法是研究IGBT模块可靠性的基础。文中将IGBT模块的结温获取方法分为了两大类,分别为结温模拟法与结温探测法,结温模拟法主要是对IGBT进行建模进而计算其结温,结温探测法是对IGBT模块的结温进行实时测量。文中分别对两大类结温获取方法进行了分析,根据各种方法的特点分别将其归类并进行阐述,并对比分析了各方法的优缺点,给出了适用范围。最后指出了结温探测的发展趋势以及需要解决的关键问题,以促进该领域的进一步发展。

Review of IGBT Junction Temperature Acquisition method

Life prediction and reliability analysis of IGBT modules has a close relationship with junction temperature,so the acquisition method of IGBT junction temperature is the basis to enhance the reliability of IGBT modules.In this paper,the IGBT junction temperature acquisition method is divided into simulation method and detection method.Junction temperature simulation method is setting up IGBT models firstly and then computing the junction temperature,and the detection method is measuring the junction temperature of IGBT in real time.This paper analyzes the two categories of junction temperature acquisition method,classifies all the measurement methods by their characteristics and expounds respectively,and then,describes their advantages and disadvantages,as well as the range of application.At last,this paper points out the trend of measurement and the key issues to be solved,so as to promote the further development of the field.