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Radiation-induced depassivation of latent plasma damage
Authors:G Cellere  A Paccagnella  L Pantisano  M G Valentini  O Flament  O Mousseau and P G Fuochi
Affiliation:

a Dipartimento di Elettronica ed Informatica, Università di Padova, 35135 Padova, Italy

b Dipartimento di Elettronica ed Informatica, Università di Padova, Padova, Italy

c ST Microelecronics, via C. Olivetti 2, Agrate Brianza, Milan, Italy

d CEA-DAM, Bruyeres-le-châtel, France

e CNR-FRAE, Bologna, Italy

Abstract:Plasma treatments are widely used in microelectronic industry but they may leave some residual passivated damage in the gate oxides at the end of the processing. The plasma-induced damage can be amplified by metal interconnects (antenna) attached to the gate during the plasma treatments. Ionising radiation reactivates this latent damage, which produces enhanced oxide charge and Si/SiO2 interface state density. Two CMOS technologies have been investigated, with 5 and 7 nm gate oxides. Threshold voltage shifts, transconductance decrease, and interface traps build-up are always larger for plasma damaged devices than for reference devices.
Keywords:CMOS  Plasma damage  Radiation  Gate oxide
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