50 μm级D形硬质合金微铣刀铣削纯铜试验研究

针对折叠波导慢波结构的微型化和高精度要求,采用自研的μEM-200CDS2组合高精度加工机床,通过线电极电火花磨削技术,制备出直径为50 μm级的D形微铣刀。在纯铜工件上开展工艺试验,研究微槽的表面质量。使用白光干涉仪、超景深显微镜、扫描电镜等仪器来观察微槽的变化情况,获得了微槽表面形貌、粗糙度等随铣削距离的变化规律,并对微铣削过程中的表面质量变化及毛刺形成的现象进行了分析。结果表明,槽底刀具的旋转轨迹纹路先是集中在刀具切出方向,随着刀具磨损,转为刀具进给方向;微槽顺铣侧毛刺多于逆铣侧,并随着铣削距离的增加而增多;微槽槽底粗糙度以线性增长趋势不断上升。

Experimental Study on Milling Pure Copper with 50 μm D-Shaped Cemented Carbide Micro-Milling Cutter

According to the requirement of miniaturization and high precision of folded waveguide slow wave structure, D-Shaped micro-milling cutter with diameter of 50 μm is fabricated by WEDG with the self-developed μEM-200CDS2 combined high precision machine tool. The surface quality of the microgroove is studied by the process test on the pure copper workpiece. White-light interferometer, ultra-depth-of-field microscope and scanning electron microscope are used to observe the variation of surface morphology and roughness of micro-grooves with milling distance, and the surface quality and burr formation during micro-milling are analyzed. These results show that the revolving track of the groove bottom tool is firstly concentrated in the cutting direction of the tool, and with the tool wear, it turnes to the feed direction of the tool. The burrs on the milling side of the micro groove are more than those on the reverse side, and increases with the increase of milling distance. Additionally, the roughness of the groove bottom increases with the linear growth trend.