基于微元材料去除模型的单摆抛光平面度预测

为探究单摆参数对抛光工件平面度的影响，提出一种基于速度和压强分布耦合的抛光微元材料去除模型，以预测工件表面平面度。从单颗磨粒的材料去除出发，建立工件表面各微元单位时间内材料去除厚度模型，并将工件相对抛光垫速度和工件表面压强分布耦合代入模型；根据工件初始面形提取微元高度值，结合各微元材料去除的厚度，计算抛光后的工件表面平面度；试验验证平面度预测方法。结果表明：仿真与实际抛光后的面形的变化趋势相同，平面度PV₂₀值绝对偏差小于12.0%，平面度预测可靠。

Flatness prediction of single pendulum polishing based on microelement material removal model

A microelement material removal model was proposed to explore the influence of single pendulum parameters on the polishing flatness of workpiece. Based on the coupling of velocity and pressure distribution, the model could predict the polishing flatness. Starting from the material removal of single abrasive particle, the model of material removal height of each microelement on the workpiece surface in unit time was established. The velocity of workpiece relative to polishing pad and pressure distribution of workpiece surface was coupled and inserted into the model. According to the initial surface shape of workpiece, the height value of microelement was extracted, and the flatness of the workpiece after polishing was calculated combined with the thickness of microelement material removal. Experiments were carried out to validate the flatness prediction method. The results show that the change trend of the surface shape after simulated polishing is same as actual polishing, and the absolute deviation of flatness PV₂₀ is less than 12.0%. The flatness prediction is reliable.