| HDI工艺中取代涂树脂铜箔适合激光钻孔的半固化片 |
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| 引用本文： | 高艳丽,朱斌. HDI工艺中取代涂树脂铜箔适合激光钻孔的半固化片[J]. 印制电路信息, 2006, 0(1): 27-29 |
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| 作者姓名： | 高艳丽 朱斌 |
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| 作者单位： | 江南计算机技术部研究所,214083 |
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| 摘 要： | 应用于HDI的激光钻孔半固化片的方法和其它常规材料相比具有的优缺点。
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| 关 键 词： | 激光钻孔 涂树脂铜箔 无纺布 微孔 |
Laser Drillable Prepreg Alternative to Resin Coated Copper Foil for HDI Applications |
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| Gao Yanli,Zhu Bin. Laser Drillable Prepreg Alternative to Resin Coated Copper Foil for HDI Applications[J]. Printed Circuit Information, 2006, 0(1): 27-29 |
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| Authors: | Gao Yanli Zhu Bin |
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| Affiliation: | Gao Yanli Zhu Bin |
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| Abstract: | This paper discusses the attributes and short falls of laser drillable prepregs in comparison to other material types commonly used in HDI applications. |
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| Keywords: | HDI |
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