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高速混合PCB板的电磁兼容性设计
引用本文:黄盛林,姜海勋. 高速混合PCB板的电磁兼容性设计[J]. 兵工自动化, 2005, 24(4): 99-101
作者姓名:黄盛林  姜海勋
作者单位:海军航空工程学院,科研部,山东,烟台,264001;海军航空工程学院,研究生管理大队,山东,烟台,264001
摘    要:高速混合PCB的电磁兼容性设计首要解决合理安排布局布线和接地问题.分析基频和高频谐波、信号上升或下降速率,电路的等效分布参数,传导耦合、辐射耦合和不匹配线的辐射、串音干扰等.根据板层、电源平面、时钟电路和高频电路的布线原则进行布局布线.接地选择单点或多点接地.

关 键 词:高速混合PCB板  电磁兼容性  布局布线  接地
文章编号:1006-1576(2005)04-0099-03
收稿时间:2004-11-11
修稿时间:2004-11-112005-01-12

Design of EMC for PCB
HUANG Sheng-lin,JIANG Hai-xun. Design of EMC for PCB[J]. Ordnance Industry Automation, 2005, 24(4): 99-101
Authors:HUANG Sheng-lin  JIANG Hai-xun
Abstract:The problem of reasonable layout wiring and grounding is firstly resolved in design of EMC for PCB with high-speed and digital and analog mixed signals. The fundamental frequency and high frequency harmonic wave, changing speed of signals, distributing parameters of the circuit, conducting coupling, radiate coupling, radiating of unsuited wires and mix disturbances was analyzed. The Layout-wiring was put up according to of layers PCB, plane of power supply, the layout and wiring rules of clock circuit and high frequency circuit, Grounding by one spot or more spots was selected.
Keywords:PCB with high-speed and mixed signals   EMC   Layout-wiring   Grounding
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