| 常温低真空键合设备和键合质量的评价 |
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| 引用本文： | 郑志霞,冯勇建. 常温低真空键合设备和键合质量的评价[J]. 沈阳工程学院学报(自然科学版), 2007, 3(4): 379-381 |
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| 作者姓名： | 郑志霞 冯勇建 |
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| 作者单位： | 1. 莆田学院,电信系,福建,莆田,351100
2. 厦门大学,机电系,福建,厦门,361000 |
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| 摘 要： | 键合工艺是微机电系统的重要工艺,是制作MEMS器件成功的关键.基于硅-硅键合技术,设计了一种能在低洁净、室温、常压环境下使用的低真空键合设备.介绍了基于该键合设备的键合工艺及键合质量的评价办法及标准.使用该设备对不同材质的样品进行键合实验,结果表明,键合出来的样品结合强度高,键合面没有缺陷,表明该设备有一定的实用性.
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| 关 键 词： | 键合 质量评价 结合强度 |
| 文章编号： | 1673-1603（2007）04-0379-03 |
| 修稿时间： | 2007-01-15 |
A Low Vacuum Bonding Equipment under Normal Temperature and the Evaluation of Bonding Quality |
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| ZHENG Zhi-xia,FENG Yong-jian. A Low Vacuum Bonding Equipment under Normal Temperature and the Evaluation of Bonding Quality[J]. Journal of Shenyang Institute of Engineering(Natural Science Edition), 2007, 3(4): 379-381 |
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| Authors: | ZHENG Zhi-xia FENG Yong-jian |
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| Abstract: | The bonding technology is important and it's the key of MEMS equipment production.Based on the wafer bonding technology,an equipment for uniform force wafer bonding is designed which can be used to room temperature and low clean environment.The paper introduces the equipment and bonding quality evaluation.Experiments of different wafer bonding are carried out with the equipments.The results of the experiments indicate that the samples have good capability of combination and have no defect.It's proved that the equipments have practical value. |
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| Keywords: | MEMS |
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