| 石英晶片研磨加工的试验研究 |
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| 引用本文： | 侯献军.石英晶片研磨加工的试验研究[J].工具技术,2017,51(5):88-90. |
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| 作者姓名： | 侯献军 |
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| 作者单位： | 沈阳理工大学 |
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| 摘 要： | 在微电子领域,石英晶片主要用于制造石英晶振器件。石英晶片的质量直接影响晶振的性能与可靠性,而研磨是保证石英晶片表面质量的重要工艺措施。本文采用行星式双面研磨机对石英晶片进行了研磨加工试验,研究了研磨区压强对加工效率的影响。试验结果表明,在相同工艺条件下,材料去除量随着研磨区压强的增大而增大。
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| 关 键 词： | 石英晶片 精密研磨 双面研磨机 |
Experimental Investigation on Lapping Quartz Crystal Substrate |
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| Hou Xianjun.Experimental Investigation on Lapping Quartz Crystal Substrate[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2017,51(5):88-90. |
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| Authors: | Hou Xianjun |
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| Abstract: | In the field of microelectronics,quartz crystal substrate is mainly used for fabricating crystal oscillator.The quartz crystal substrate quality directly affects the performance and reliability of the crystal oscillator,and lapping is important technical measures to ensure the quality of crystal oscillator.A double side lapping machine is used for investigating the influence of the lapping pressure on the machining efficiency.The test results reveal that the material removal rate of lapping is increased with the increase of the lapping pressure. |
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| Keywords: | quartz crystal substrate precision lapping double side lapping machine |
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