| CCL中铜屑产生原因的分析和处理 |
| |
| 引用本文： | 黎志勇. CCL中铜屑产生原因的分析和处理[J]. 印制电路信息, 2005, 0(9): 31-32 |
| |
| 作者姓名： | 黎志勇 |
| |
| 作者单位： | 台光电子材料有限公司,214101 |
| |
| 摘 要： | 通过分析CCL中铜屑产生的原因,阐明了CCL中铜屑的预防和发生铜屑的处理。
|
| 关 键 词： | 刷辊 铜屑 摩擦 间隙 |
The Root Cause of Copper Scale and How to Deal With It |
| |
| Li Zhiyong. The Root Cause of Copper Scale and How to Deal With It[J]. Printed Circuit Information, 2005, 0(9): 31-32 |
| |
| Authors: | Li Zhiyong |
| |
| Abstract: | The paper analysis the cause of copper scale and describes the prevention of the scraps,and how to deal with the copper scale. |
| |
| Keywords: | roller copper scale friction clearance |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
