| IGBT模块的热设计概述 |
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| 引用本文： | 刘国友,王彦刚,罗海辉,齐放,李想,吴义伯.IGBT模块的热设计概述[J].中国电力,2012,53(12):55-61,74. |
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| 作者姓名： | 刘国友 王彦刚 罗海辉 齐放 李想 吴义伯 |
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| 作者单位： | 1. 新型功率半导体器件国家重点实验室，湖南 株洲 412001;2. 株洲中车时代电气半导体有限公司，湖南 株洲 412001;3. Dynex半导体有限公司，林肯 LN6 3LF |
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| 基金项目： | 国家重点研发计划资助项目(2017YFB01023，2017YFB0102303) |
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| 摘 要： | 对IGBT模块的热特性和热设计进行概述，介绍IGBT模块的热阻抗网络模型及其与封装材料热性能及尺寸的关系；从芯片和模块封装材料、结构等方面讨论模块的热设计要点，并阐述传统IGBT模块及新型压接式IGBT模块的热设计。
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| 关 键 词： | IGBT模块 热设计 可靠性 |
| 收稿时间： | 2020-07-28 |
A Review of Thermal Design for IGBT Module |
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| LIU Guoyou,WANG Yangang,LUO Haihui,QI Fang,LI Xiang,WU Yibo.A Review of Thermal Design for IGBT Module[J].Electric Power,2012,53(12):55-61,74. |
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| Authors: | LIU Guoyou WANG Yangang LUO Haihui QI Fang LI Xiang WU Yibo |
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| Affiliation: | 1. State Key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou, 412001, China;2. Zhuzhou CRRC Times Electric Semiconductor Co., Ltd., Zhuzhou, 412001, China;3. Dynex Semiconductor Co., Ltd., Lincoln LN6 3LF, UK |
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| Abstract: | In this paper, the thermal characteristics and thermal design of IGBT module are reviewed. Firstly, the thermal network model and its dependence on the packaging material’s thermal performance and dimensions are addressed. Then, the thermal design of IGBT module is investigated in terms of semiconductor chip, packaging structure and material. Finally, the main thermal design aspects of conventional IGBT module and new press-pack IGBT module are presented. |
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| Keywords: | IGBT module thermal design reliability |
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