产品导向的先进封装设计

在日益激烈竞争的电子工业中,高成本效益、高可靠性的电子封装方案不单是电子产品发展的主要驱动力,甚至往往成为当中的促成科技(EnablingTechnology),用于轻巧、细小的无线电/可携带式消费性电子产品中尤见适合。其中更理想的性能效益(cost/performanceratio)、更短的产品开发周期、集多功能于一身的消费性电子产品亦是崭新科技应用的主要原动力。要达到以上目标,相关的微电子封装方案与焊接技术的进步是不可或缺的:例如从金属线焊接技术发展到倒装芯片技术,及至近年的晶圆级封装技术;从外围焊接(peripheral)发展到数组焊接(area-array);从陶制基版发展到有机基版;从单芯片封装发展到复芯片封装的构装方案等。事实上,系统级封装比一般的封装方案拥有一定的优势。在报告中首先概述最近在系统级封装的发展情况与应用。另外,借此报告突显出跟供应链有关产业之间的密切协调是达到有效而迅速地执行系统级封装的关键。最后,在报告中进一步详述一个集顶尖封装设计、分析及可靠性评估技术的服务中心的好处,及如何对工业界从事原型设计发展到大量生产的协助。

Product-Oriented Advanced Packaging Design

Cost-effective and reliable electronic packaging has been identified as not only a major drivingforce but also an enabling technology in today's highly competitive electronics industry, especially for thewireless/portable electronic products which require lighter, smaller form-factors electronic componentsor modules. In order to meet the demands from the above drivers, microelectronics packaging andinterconnect related technologies have evolved from wire bond to flip chip, and eventually to wafer-levelchip scale package (WLCSP); from peripheral to area array interconnects; from ceramic to organicsubstrate materials; and from single chip package to multi-chips system-in-package (SiP).In fact, SiP possesses a number of advantages over conventional packaging and therefore in this studywe first present an overview on the recent developments and applications of SiP. It is also necessary tohighlight that close co-ordination across the entire supply chain in the electronics industry is the key forprompt SiP implementation. Finally, we put forward to illustrate the critical demands on a centre withintegrated packaging design, analysis and characterization capabilities to assist the industries in developingtheir own SiP products targeting for mass production.