Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn-Ag-Cu solder and ENEPIG substrate during a reflow process |
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| Authors: | Jeong-Won Yoon Bo-In NohJae-Hyun Yoon Han-Byul KangSeung-Boo Jung |
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| Affiliation: | a School of Advanced Materials Science and Engineering, Sungkyunkwan University, 300 Cheoncheon-dong, Jangan-gu, Suwon, Gyeonggi-do 440-746, Republic of Korea
b High Voltage Electron Microscopy Station, National Institute for Materials Science, 3-13 Sakura, Tsukuba 305-0003, Japan |
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| Abstract: | The interfacial reactions between Sn-3.0 wt.% Ag-0.5 wt.% Cu solder and an electroless nickel-electroless palladium-immersion gold (ENEPIG) substrate were investigated. After initial reflowing, discontinuous polygonal-shape (Cu,Ni)6Sn5 intermetallic compounds (IMCs) formed at the interface. During reflowing for up to 60 min, the interfacial IMCs were sequentially changed in the following order: discontinuous (Cu,Ni)6Sn5, (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4, and embedded (Cu,Ni)6Sn5 in (Ni,Cu)3Sn4. The interfacial product variation resulted from the preferential consumption of Cu atoms within the solder and continuous Ni diffusion from the Ni(P) layer. |
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| Keywords: | Sn-Ag-Cu solder Soldering Intermetallic compounds Electronic packaging |
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