The effect of edge metal profiles on the accuracy of electrical modeling of advanced packages |
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Authors: | Kaw R Burton S Ching-Chao Huang Luk C |
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Affiliation: | Semicond. Product Group, Agilent Technol., Santa Clara, CA, USA; |
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Abstract: | Electronic package edge metal profiles have an effect on package characteristics on an order increasingly close to the tolerances expected for the package electrical performance. Several two-dimensional (2-D) tools are available that can be used to evaluate predesign and layout issues with nonrectangular edge profiles. However, tools that extract models from actual designs using the most up-to-date computer-aided design/computer-aided engineering (CAD/CAE) design and modeling flows do not yet take into account these real-world metal geometries. Variations in impedance and crosstalk associated with real profiles versus rectangular idealizations are identified for some typical cases and a computational procedure is discussed which may efficiently address this problem. |
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