| 埋入电容印制板工艺技术 |
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| 引用本文： | 陈岩.埋入电容印制板工艺技术[J].印制电路信息,2003(3):66-68. |
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| 作者姓名： | 陈岩 |
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| 作者单位： | 江南计算技术研究所,214083 |
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| 摘 要： | 本篇文章讨论的是采用两种基材制作四层埋入电容印制板的方法FR-4基材和FR-406电容材料分别经过单面 图形转移,再经层压到外层制作的路线完成此四层板尺寸变化较小,能够很好地配合高层数多层板的工艺制作。
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| 关 键 词： | 埋入电容 印制板工艺 单面图形转移 |
| 修稿时间： | 2003年2月17日 |
The Craft Technology of Buried Capacitance PCB |
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| Chen Yan.The Craft Technology of Buried Capacitance PCB[J].Printed Circuit Information,2003(3):66-68. |
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| Authors: | Chen Yan |
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| Abstract: | In this paper, we discuss an innovated technology of embedding capacitance in PWB by using two kind of laminares. Firstly we etch single-sided pattern with FR-4 and FR-406, then laminate the two materials, finally fabricate the outlayer patterns. This method has not only a better dimensional consistence than other ways, but it could be very compatible with super multilayer pcb technology. |
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| Keywords: | embedded capacitance PCB technology single-sided pattern transfering |
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