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非金属表面化学镀活化方法的研究现状
引用本文:黄洁,刘祥萱,吴春. 非金属表面化学镀活化方法的研究现状[J]. 电镀与涂饰, 2008, 27(12)
作者姓名:黄洁  刘祥萱  吴春
作者单位:第二炮兵工程学院,陕西,西安,710025
摘    要:介绍了近年来国内外非金属基体化学镀的活化工艺.分析表明,胶体钯活化法工艺成熟、性能优异,但存在成本高、污染重等不足;无钯活化法弥补了钯活化工艺的缺陷,显示出广阔的发展前景,但活化效果差、工艺复杂限制了它的应用.因此,开发工艺简单,活化效果显著的无钯活化工艺是今后研究的重点.

关 键 词:非金属基体  化学镀  活化工艺  胶体钯  无钯

Research status of activation methods for electroless plating on nonmetal surface
HUANG Jie,LIU Xiang-xuan,WU Chun. Research status of activation methods for electroless plating on nonmetal surface[J]. Electroplating & Finishing, 2008, 27(12)
Authors:HUANG Jie  LIU Xiang-xuan  WU Chun
Abstract:The activation processes for electroless plating on nonmetal substrate at home and abroad were introduced. The analysis showed that colloidal-palladium activation is a mature process with excellent performances, but it causes high cost and serious pollution. Pd-free activation process has a broad development prospect because of its lower cost and less pollution, but poor activating effect and complicated technics limit its application. Therefore, a simple and efficient Pd-free activation process is the targ...
Keywords:nonmetal substrate  electroless plating  activation process  colloidal palladium  palladium-free  
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