高热流微冷却器的换热性能研究

对以水为换热介质的微通道冷却器对模拟发热电子芯片进行冷却的换热性能进行了实验研究.通过测量流体的流量、进出口温度、发热片表面热流密度,获得了不同几何结构微通道冷却器在不同加热功率、不同Re数条件下的换热特性和冷却效果.结果表明,微通道冷却器可以有效地对表面热流密度高达5.34×105 W/m2的发热电子芯片进行冷却;微通道冷却器的换热性能随Re数的增大而提高,所提高的幅度随加热功率的增大而增大;微通道的几何结构对换热性能有显著影响,平均Nu数随微通道的宽深比增大而增大.

Thermal Performance of High Heat Flux Micro Heat Sinks

The experimental investigation on the thermal performance of microchannel heat sinks for cooling the integrated electronic chip with the high power density using the liquid-cooling technology was conducted. The characteristics of convective heat transfer and the cooling performances for the different geometries of microchannel were obtained by measuring the flow rate, the temperatures at the inlet and outlet, and the surface heat flux under the conditions of different heating powers and different Reynolds numbers. The micro heat sink can effectively remove the high density heat generated by the integrated electronic chip on that the surface heat flux reached the value of 5.34?105 W/m2. The convective heat transfer coefficient increases with the increasing in Reynolds number. And the increasing extent increases with the increasing in the power density. The significant influence of the geometry of microchannel on the thermal performance was found. The averaged Nusselt number increases with the increasing in the ratio of width to depth of microchannel.