| 工艺参数对TiO2-Ag烧结体导电性的影响 |
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| 引用本文： | 王玉丹,刘剑虹,张涛,林枫. 工艺参数对TiO2-Ag烧结体导电性的影响[J]. 半导体技术, 2006, 31(10): 747-750,725 |
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| 作者姓名： | 王玉丹 刘剑虹 张涛 林枫 |
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| 作者单位： | 齐齐哈尔大学,无机非金属材料系,黑龙江,齐齐哈尔,161006 |
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| 摘 要： | 用sol-gel法粉体技术制备TiO2粉,在TiO2粉体上用化学镀的方法制备了Ag为包覆层的复合导电粉体.测试TiO2-Ag复合导电粉体的体积电阻率,讨论了含银量、压力、煅烧温度对其体积电阻率的影响.试验结果表明,制备的粉体导电性能良好,且粉体烧结温度低.
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| 关 键 词： | 复合导电材料 粉体材料 化学镀 工艺参数 烧结体 导电性能 影响 Agglomeration Conductivity Parameter Technical 烧结温度 结果 试验 煅烧温度 压力 体积电阻率 测试 导电粉体 包覆层 法制 化学镀 粉体技术 |
| 文章编号： | 1003-353X（2006）10-0747-04 |
| 收稿时间： | 2006-05-30 |
| 修稿时间： | 2006-05-30 |
Effect of Technical Parameter on the Conductivity of TiO2-Ag Agglomeration |
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| WANG Yu-dan,LIU Jian-hong,ZHANG Tao,LIN Feng. Effect of Technical Parameter on the Conductivity of TiO2-Ag Agglomeration[J]. Semiconductor Technology, 2006, 31(10): 747-750,725 |
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| Authors: | WANG Yu-dan LIU Jian-hong ZHANG Tao LIN Feng |
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| Affiliation: | Department of Inorganic Nonmetal Materials, Qiqihar University, Qiqihar 161006, China |
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| Abstract: | The nanometer TiO2 powder was prepared by sol-gel method. The compound conductive micro-powder with Ag coating layer on the TiO2 micro-powder was prepared by electroless plating. The volume resistivity of the TiO2-Ag compound powder was measured. The effect of the content of Ag, pressure and temperature on the conductivity of the compound micro-powder were discussed. The results indicate that the conductivity of the structure of Ag coating on TiO2 substrate have better conductivity and can be sintered at lower temperature. |
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| Keywords: | compound conductive material powder material electroless plating |
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