Application of tight-binding and path probability methods to the junction relaxation of semiconductor heterostructures |
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Authors: | K Masuda-Jindo R Kikuchi and S R Nishitani |
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Affiliation: | (1) Department of Materials Science and Engineering, Tokyo Institute of Technology, Nagatsuta, Midori-ku, 226-8503 Yokohama, Japan;(2) Materials Science and Mineral Engineering, University of California, 94720-1760 Berkeley, CA;(3) Department of Materials Science and Engineering, Kyoto University, Sakyo-ku, 606-8501 Kyoto, Japan |
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Abstract: | The atomistic and thermodynamic properties of semiconductor heterostructures are investigated by using the tight-binding (TB)
electronic theory and path probability method (PPM). The atomic diffusion in the semiconductor interface is studied via the vacancy mechanism of diffusion using the nonequilibrium irreversible statistical mechanical approach, PPM. The effective
pair interaction energies between the constituent atoms are derived by using the zeros-poles method, taking into account the
misfit strains at the interface. We study the junction relaxation processes of semiconductor heterostructures such as SiGe/Si(001),
GaAs/Si(001), and ZnSe/GaAs(001) systems. It has been found that the junction relaxation exhibits characteristic features,
e.g., overshooting and uphill diffusion along the chemical potential gradient depending on the temperature and relative magnitude
of effective pair interaction energies. It is also shown that, even for the very early stage of the junction relaxation, the
interface electronic properties are strongly influenced by the interface disorder. |
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