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石墨表面化学镀Cu对天然鳞片石墨/Al复合材料热物理性能的影响
引用本文:黄凯,白华,朱英彬,薛晨,江南,童幸生.石墨表面化学镀Cu对天然鳞片石墨/Al复合材料热物理性能的影响[J].复合材料学报,2018,35(4):920-926.
作者姓名:黄凯  白华  朱英彬  薛晨  江南  童幸生
作者单位:1. 江汉大学 机电与建筑工程学院, 武汉 430056; 2. 中国科学院 宁波材料技术与工程研究所, 宁波 315201
摘    要:对天然鳞片石墨(GF)进行化学镀Cu的表面处理,对化学镀Cu石墨(Cu-GF)和Al粉采用真空热压的工艺制备出镀Cu石墨/Al(Cu-GF/Al)复合材料。研究了Cu-GF/Al复合材料的微观结构和微观界面,同时也研究了Cu-GF对Cu-GF/Al复合材料热导率和抗弯性能的影响。结果表明,GF上的Cu层能抑制界面脆弱相Al4C3的产生,使Cu-GF/Al复合材料的抗弯性能有了显著提升。当Cu-GF体积分数从50%增加到70%时,Cu-GF/Al复合材料的抗弯强度也从104 MPa降低到74 MPa。当GF体积分数为70%时,Cu-GF/Al复合材料的热导率达到最高值为522 W/(m·K)。

关 键 词:石墨/Al  复合材料  热导率  弯曲强度  热压工艺  界面分析  
收稿时间:2017-04-18

Thermal conductivity and mechanical properties of flak graphite/Al composite with electroless Cu plating on graphite surface
HUANG Kai,BAI Hua,ZHU Yingbin,XUE Chen,JIANG Nan,TONG Xingsheng.Thermal conductivity and mechanical properties of flak graphite/Al composite with electroless Cu plating on graphite surface[J].Acta Materiae Compositae Sinica,2018,35(4):920-926.
Authors:HUANG Kai  BAI Hua  ZHU Yingbin  XUE Chen  JIANG Nan  TONG Xingsheng
Affiliation:1. School of Electrical-Mechanical Engineering, Jiang Han University, Wuhan 430056, China; 2. Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo 315201, China
Abstract:Cu was coated on the surface of the nature graphite flake (GF) by the electroless copper plating method, and then the Cu-GF/Al composites were fabricated by vacuum hot-press sintering with Cu-coated GF (Cu-GF) and Al powder. The microstructures and interfaces of Cu-GF/Al composites were studied and the effect of Cu-GF surface on the thermal conductivity and bending strength was investigated. The results show that the Cu layer inhibits the formation of Al4C3. Thus the bending strength of Cu-GF/Al composites is significantly enhanced after Cu coated and the value decreases from 104 to 74 MPa as Cu-GF volume fraction increases from 50% to 70%. The maximum thermal conductivity is 522 W/(m·K) when the volume fraction of GF is 70%.
Keywords:graphite/Al  composites  thermal conductivity  bending strength  hot pressing technique  interface analysis  
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