| 导热树脂基复合材料 |
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| 引用本文： | 丁峰 谢维章. 导热树脂基复合材料[J]. 复合材料学报, 1993, 10(3): 19-24 |
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| 作者姓名： | 丁峰 谢维章 |
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| 作者单位： | 华东化工学院, 上海 200237 |
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| 摘 要： | 本文研究了树脂基复合材料热导率,提出了环氧树脂中加入填料的新导热模型。该模型基于复合材料理想的水平和垂直导热模型,考虑了影响材料导热的多种因素,并加以修正。新模型推出的导热方程:ln(Kc)=G(f)×ln(Kv)+[1-G(f)]×lnKh,一旦所有影响材料导热的参数被确定,就能核算材料的导热率,模型计算值与实验数据相一致。
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| 关 键 词： | 导热 树脂基 复合材料 |
| 收稿时间： | 1991-09-20 |
THERMALLY CONDUCTIVE COMPOSITES |
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| Ding Feng Xie Weizhang. THERMALLY CONDUCTIVE COMPOSITES[J]. Acta Materiae Compositae Sinica, 1993, 10(3): 19-24 |
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| Authors: | Ding Feng Xie Weizhang |
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| Affiliation: | East China Institute of Chemical Technology, Shanghai 200237 |
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| Abstract: | In the study,a new thermal conduction model is proposed for filled Epoxy resins with metal particles.The modelis fundamentally based on the generalization of vertically and horizonally ideal conduction model of composites and is modified in considering that the parameters have influrcences on thermally conductive composites. The following equation is ceived from the new model: ln(Kc)=G(f)×ln(Kv)+[1-G(f)]×lnKh. Once all parameters are known,the thermal conductivity of resin composites filled with particles cmn be evaluated,The calculated values coincide with the experimental data. |
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| Keywords: | thermal conductivity polymer composite |
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