| 浅谈多层印制电路板的设计和制作 |
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| 引用本文： | 蒋耀生. 浅谈多层印制电路板的设计和制作[J]. 电子工艺技术, 1998, 19(5): 179-183 |
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| 作者姓名： | 蒋耀生 |
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| 作者单位： | 株洲电力机车研究所 |
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| 摘 要： | 从生产制作工艺的角度介绍了多层印制电路板设计时应考虑的主要因素，阐述了外形与布局、层数与厚度、孔与焊盘、线宽与间距的影响因素，设计原则及其计算关系。文中结合生产实践对重点制作过程加以说明。
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| 关 键 词： | 多层印制电路板 设计 制作 黑化 凹蚀 层压 |
Multiayer Printed Circuit Board Design and Manufacture |
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| Jiang Yaosheng Zhuzhou Electric Locomotive Research Institute. Multiayer Printed Circuit Board Design and Manufacture[J]. Electronics Process Technology, 1998, 19(5): 179-183 |
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| Authors: | Jiang Yaosheng Zhuzhou Electric Locomotive Research Institute |
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| Affiliation: | Jiang Yaosheng Zhuzhou Electric Locomotive Research Institute |
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| Abstract: | Form the production technology view point,the main factors should be considered during the multilayer printed circuit board and also detailed the effective factors,design rules and their relationship beween profile and lay-out,line width and spacing,layers and board thickness,holes and land size.It is explained the manufacturing process with combination of the production practice. |
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| Keywords: | Multilayer printed circuit board Design Manufacture Black oxide Etchback Laminate |
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