| 陶瓷-金属封接的化学镀镍工艺 |
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| 引用本文： | 刘慧卿. 陶瓷-金属封接的化学镀镍工艺[J]. 真空电子技术, 2006, 0(2): 55-56,58 |
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| 作者姓名： | 刘慧卿 |
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| 作者单位： | 北京真空电子技术研究所,北京,100016 |
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| 摘 要： | 讨论了陶瓷-金属封接中化学镀镍与电镀镍工艺及相互之间的区别。
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| 关 键 词： | 陶瓷-金属封接 二次金属化 电镀镍 化学镀镍 抗拉强度 |
| 文章编号： | 1002-8935（2006）02-0055-02 |
| 收稿时间： | 2005-11-30 |
| 修稿时间： | 2005-11-30 |
A Chemical Nickel Plating Technique of Ceramic-Metal Seals |
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| LIU Hui-qing. A Chemical Nickel Plating Technique of Ceramic-Metal Seals[J]. Vacuum Electronics, 2006, 0(2): 55-56,58 |
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| Authors: | LIU Hui-qing |
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| Affiliation: | Beijing Vacuum Electronics Research Institute, Beijing 100016, China |
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| Abstract: | The paper discusses the techniques of chemical plated nickel and electroplated nickel, as well as their difference in the ceramic-metal seal process. |
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| Keywords: | Ceramic-metal seal Second metallizing strength Electroplated nicke Chemical plated nickel Tensile |
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