Cu基电触头用掺杂SnO2纳米粉体的制备

利用溶胶-凝胶工艺制备了Cu基电触头用TiO2掺杂SnO2纳米粉。实验时,首先采用TG-DSC方法对掺杂SnO2前驱体在升温过程中的转变过程进行了分析,然后采用XRD对不同温度焙烧所得掺杂SnO2粉体进行了物相分析、颗粒粒径计算,采用TEM对掺杂SnO2粉体的微观形貌进行了观察,最后通过分析掺杂SnO2粉体晶格参数d值的变化对粉体的掺杂效果进行了评估。结果表明:通过所述工艺成功实现了TiO2对纳米SnO2的掺杂,500℃焙烧所得掺杂SnO2为圆球形,粒径约为10 nm,较好地满足Cu基电触头材料使用的需求。

Fabrication of Doped SnO2 Powder Used for Cu Matrix Electrical Contact

TiO2 doped SnO2 nano powder used for Cu matrix electrical contact materials was prepared by a sol-gel method. The transformation process of the doped SnO2 precursor during heating was analyzed by TG-DSC technique. Then, phase analysis and particle size calculation of the doped SnO2 powders calcined at different temperatures were carried out by XRD, and the microscopic morphology of the doped SnO2 powder was observed by TEM. Finally, the doping result of SnO2 powder was evaluated by analyzing the change of the lattice parameter d value. The results show that nanometer SnO2 can be successfully doped by TiO2 using the present method. The doped SnO2 calcined at 500 oC is spheroidal in shape, and about 10 nm in diameter. It can entirely meet the need of Cu matrix electrical contact materials.