| 无氰沉金工艺的实践 |
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| 引用本文： | 高林军,董振华.无氰沉金工艺的实践[J].印制电路信息,2010(Z1):1-8. |
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| 作者姓名： | 高林军 董振华 |
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| 作者单位： | 1. 深圳市荣伟业电子有限公司
2. 深圳市亚星电化工有限公司 |
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| 摘 要： | 本文介绍无氰沉金工艺特性,主要特性是无氰沉金金面均匀性高及其可减少黑盘(pad)的产生机率、更环保。替代传统的沉金工艺有着显著的优势。随着PCB生产技术成熟、环保的要求不断提升,工艺市场潜力将非常大。此项工艺的也符合环保要求,所以倍受PCB同行的关注。
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| 关 键 词： | 无氰沉金 黑盘(pad) 均匀性 |
Cyanoqen free immersion gold process |
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| GAO Lin-jun,DONG Zhen-hua.Cyanoqen free immersion gold process[J].Printed Circuit Information,2010(Z1):1-8. |
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| Authors: | GAO Lin-jun DONG Zhen-hua |
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| Affiliation: | GAO Lin-jun DONG Zhen-hua |
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| Abstract: | This article describes the characteristics of Cyanide-Free Immersion Gold process, which has high uniformity and reduce probability of black-PAD. And compared with the traditional immersion gold, this process has very big advantage. With PCB manufacturing technology and environmental requirements rising, this process will have very large market . This process meet environmental requirement. So we must pay attention to it. |
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| Keywords: | Cyanide-Free Immersion Gold Black-PAD COV |
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