| 在NaCl溶液中CTAB、SDS和钨酸钠对印刷电路板缓蚀作用研究 |
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| 引用本文： | 张敏,林昌健. 在NaCl溶液中CTAB、SDS和钨酸钠对印刷电路板缓蚀作用研究[J]. 腐蚀科学与防护技术, 2009, 21(2) |
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| 作者姓名： | 张敏 林昌健 |
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| 作者单位： | 厦门大学化学化工学院化学系,固体表面物理化学国家重点实验室,厦门,361005 |
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| 摘 要： | 采用电化学阻抗和极化曲线法,研究了在NaCl溶液中,钨酸钠、十六烷基三甲基溴化铵(CTAB)及十二烷基硫酸钠(SDS)的单一配方以及其复配对印刷电路板的缓蚀作用.结果表明:CTAB、SDS和钨酸钠各自的单一配方对印刷电路板(PCB)均具有一定的缓蚀作用,其中CTAB浓度为1.0×10-4mol/L,SDS浓度为5.0×10-3mol/L及350 me,/L钨酸钠表现出最佳的缓蚀效率;SDS和钨酸钠属于阳极型缓蚀剂,CTAB为混合型缓蚀剂;当二者复配使用时,浓度为250 ms/L钨酸钠和1.0 x 10-4moL/L CTAB以及300 mg/L钨酸钠和5.0×10-3～moL/L SDS的复配缓蚀剂的缓蚀效果最佳,复配缓蚀剂具有协同效应,并且对印刷电路板的缝隙腐蚀有一定的抑制作用.
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| 关 键 词： | 钨酸钠 缓蚀剂 印刷电路板 |
CORROSION INHIBITION OF CTAB,SDS AND Na2WO4 FOR PRINT CIRCUIT BOARD IN NEUTRAL NaCI SOLUTION |
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| ZHANG Min,LIN Chang-jian. CORROSION INHIBITION OF CTAB,SDS AND Na2WO4 FOR PRINT CIRCUIT BOARD IN NEUTRAL NaCI SOLUTION[J]. Corrosion Science and Protection Technology, 2009, 21(2) |
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| Authors: | ZHANG Min LIN Chang-jian |
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| Affiliation: | ZHANG Min,LIN Chang-jian State Key Laboratory for Physical Chemistry of Solid Surfaces,, Department of Chemistry,College of Chemistry , Chemical Engineering,Xiamen University,Xiamen 361005 |
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| Abstract: | In this paper,the typical cation surfactants,such as cetyl trimethyl ammonium bromide(CTAB),anion surfactant sodium dodecyl sulphate(SDS)and sodium tungstate(Na2WO4)were studied as inhibitor for print circuit board(PCB)in neutral NaCl solution by polarization curve and electrochemical impedance spectroscopic.Moreover,the inhibition behavior of the mixture of Na2WO4,CTAB and SDS was also studied.It is indicated that CTAB,SDS and sodium tungstate all show certain inhibition effect for PCB.CTAB has a better in... |
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| Keywords: | CTAB SDS |
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