Preparation of cobalt oxide films by plasma-enhanced metalorganic chemical vapour deposition

Co oxide films were prepared on glass substrates at 150–400°C by plasma-enhanced metalorganic chemical vapour deposition using cobalt (II) acetylacetonate as a source material. NaCl-type CoO films were formed at low O₂ flow rate of 7cm³ min^–1 and at a substrate temperature of 150–400°C. The CoO films possessed (100) orientation, independent of substrate temperature. Deposition rates of the CoO films were 40–47 nm min^–1. The CoO film deposited at 400 °C was composed of closely packed columnar grains and average diameter size at film surface was 60 nm. At high O₂ flow rate of 20–50 cm³ min^–1, high crystalline spinel-type Co₃O₄ films were formed at a substrate temperature of 150–400°C. The Co₃O₄ film deposited at 400°C possessed (100) preferred orientation and the film deposited at 150°C possessed (111) preferred orientation. Deposition rates of the Co₃O₄ films were 20–41 nm min^–1. Both Co₃O₄ films with (100) and (111) orientation had columnar structure. The shape and average size of the columnar grains at the film surface were different; a square shape and 35 nm for (100)-oriented Co₃O₄ film and a hexagonal shape and 60 nm for (111)-oriented film, respectively.