首页 | 本学科首页   官方微博 | 高级检索  
     

四马来酰亚胺改性有机硅酚醛树脂性能的研究
引用本文:王超,黄玉东,姜丽华,郑力威. 四马来酰亚胺改性有机硅酚醛树脂性能的研究[J]. 复合材料学报, 2004, 21(4): 50-53
作者姓名:王超  黄玉东  姜丽华  郑力威
作者单位:1.哈尔滨工业大学 410信箱 哈尔滨 150001;
摘    要:研究了四马来酰亚胺对有机硅酚醛树脂的耐热性能、粘接性能和贮存性能等的影响。结果表明在四马来酰亚胺改性有机硅酚醛树脂固化过程中,四马来酰亚胺的双键与有机硅酚醛树脂的羟甲基发生加成反应,提高了有机硅酚醛树脂的耐热性能和粘接强度,并保持其韧性,但也造成常温贮存期有所下降。这是由于四马来酰亚胺在制备过程中缩合不完全,存在少量羧基和胺基,常温下与有机硅酚醛树脂羟甲基发生缩合造成的。 

关 键 词:四马来酰亚胺   改性   有机硅酚醛树脂
文章编号:1000-3851(2004)04-0050-04
收稿时间:2003-05-27
修稿时间:2003-11-06

STUDY ON THE TETRAMALEIMIDE MODIFICATION POLYPHENYLMENTHYLSILOXANE PHENOLIC RESIN
WANG Chao,HUANG Yudong,JIANG Lihua,ZHENG Liwei. STUDY ON THE TETRAMALEIMIDE MODIFICATION POLYPHENYLMENTHYLSILOXANE PHENOLIC RESIN[J]. Acta Materiae Compositae Sinica, 2004, 21(4): 50-53
Authors:WANG Chao  HUANG Yudong  JIANG Lihua  ZHENG Liwei
Affiliation:1.P.O.Box 410, Harbin Institute of Technology, Harbin 150001, China;2.Adhesive Science and Technology Center,Heilongjiang Petrochemistry Institute, Harbin 150040, China
Abstract:The heat-resistant property, adhesive strength and storage life were studied for Tetramaleimide (TMI) modificated polyphenylmenthylsiloxane phenolic resin (PFSi) by IR, DSC and TG analysis methods. At the curing temperature of tetramaleimide modificated polyphenylmenthylsiloxane phenolic resin(TMI/PFSi), the C C group of TMI was condensed with —CH2OH of PFSi into crosslinking structure, since the heat-resistant property and adhesive strength of PFSi are increased, the toughness is kept, and the storage life is decreased. At room temperature, a small amount of the COOH, and NH2 groups of TMI (because of the steric effection, carboxyl and amino of TMI are not all condensed into imide) are condensed with —CH2OH of PFSi into a small amount of crosslinking structural oligomer, which makes the storage life of TMI/PFSi decrease.
Keywords:tetramaleimide  modification  polyphenylmenthylsiloxane modification phenolic formaldehyde resin
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《复合材料学报》浏览原始摘要信息
点击此处可从《复合材料学报》下载免费的PDF全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号