Using Numerical Analysis to Develop and Evaluate the Method of High Temperature Sous‐Vide to Soften Carrot Texture in Different‐Sized Packages

The high‐temperature sous‐vide (HTSV) method was developed to prepare carrots with a soft texture at the appropriate degree of pasteurization. The effect of heating conditions, such as temperature and time, was investigated on various package sizes. Heating temperatures of 70, 80, and 90 °C and heating times of 10 and 20 min were used to evaluate the HTSV method. A 3‐dimensional conduction model and numerical simulations were used to estimate the temperature distribution and the rate of heat transfer to samples with various geometries. Four different‐sized packages were prepared by stacking carrot sticks of identical size (9.6 × 9.6 × 90 mm) in a row. The sizes of the packages used were as follows: (1) 9.6 × 86.4 × 90, (2) 19.2 × 163.2 × 90, (3) 28.8 × 86.4 × 90, and (4) 38.4 × 86.4 × 90 mm. Although only a moderate change in color (L*, a*, and b*) was observed following HTSV cooking, there was a significant decrease in carrot hardness. The geometry of the package and the heating conditions significantly influenced the degree of pasteurization and the final texture of the carrots. Numerical simulations successfully described the effect of geometry on samples at different heating conditions.