脉冲电沉积法制备高P镍基合金镀层

研究了脉冲参数(脉冲高度、宽度、以及反向脉冲等参数)对Ni-P合金镀层P含量、微观形貌等特性影响的规律。结果表明，平均电流密度与反向脉冲电流密度对镀层的P含量有较大地影响；占空比、频率对镀层的微观形貌影响较大。与直流电沉积法制备的Ni-P镀层相比，在不改变镀液组成的条件下，脉冲电沉积法可以显著提高Ni-P合金镀层的P含量。

PULSE ELECTRODEPOSITION OF NICKEL MATRIX ALLOY COATINGS WITH HIGH CONTENT OF PHOSPHORUS

This paper discussed the influence of pulse parameters (pulse height, pulse width and reverse pulse variables) on the phosphorous content and morphology of Ni-P coatings. The result showed that both average current density and reverse anodic current density had a strong effect on the phosphorous content, whereas duty circle and frequency had great impact on the morphology of coatings. Compared with the Ni-P coatings prepared via direct current electrodeposition, pulse plating method increases the content of phosphorous without changing the composition of the solution.