| Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process |
| |
| 作者姓名： | XU Rongchang TANG Di REN Xueping WANG Xiaohong WEN Yonghong |
| |
| 作者单位： | National Engineering Research Center for Advanced Rolling Technology, University of Science and Technology Beijing, Beijing 100083, China |
| |
| 摘 要： | The matrix accumulative roll bonding technology （MARB） can improve the matrix performance of metal composite and strengthen the bonding quality of the interface./n this research, for the fwst time, the technology of MARB was proposed. A sound Cu/AI bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope （SEM） and energy-dispersive spectroscopy （EDS）. The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/AI composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/AI composite with sound interface was obtained as well.
|
| 关 键 词： | 复合材料 矩阵 接口焊接 退火 |
| 收稿时间： | 2 November 2005 |
| 修稿时间： | 2005-11-02 |
Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process |
| |
| XU Rongchang TANG Di REN Xueping WANG Xiaohong WEN Yonghong.Improvement of the matrix and the interface quality of a Cu/Al composite by the MARB process[J].Rare Metals,2007,26(3):230-235. |
| |
| Authors: | XU Rongchang TANG Di REN Xueping WANG Xiaohong WEN Yonghong |
| |
| Affiliation: | National Engineering Research Center for Advanced Rolling Technology, University of Science and Technology Beijing, Beijing 100083, China |
| |
| Abstract: | The matrix accumulative roll bonding technology (MARB) can improve the matrix performance of metal com- posite and strengthen the bonding quality of the interface. In this research, for the first time, the technology of MARB was proposed. A sound Cu/Al bonding composite was obtained using the MARB process and the bonding characteristic of the interface was studied using scanning electricity microscope (SEM) and energy-dispersive spectroscopy (EDS). The result indicated that accumulation cycles and diffusion annealing temperature were the most important factors for fabricating a Cu/Al composite material. The substrate aluminum was strengthened by MARB, and a high quality Cu/Al composite with sound interface was obtained as well. |
| |
| Keywords: | matrix accumulative roll bonding Cu/Al composite material interface bonding diffusion annealing |
| 本文献已被 CNKI 维普 万方数据 ScienceDirect 等数据库收录！ |
