Improving bonding strength of tape-automated bonding technology by implementing statistical process control: a case study

The purpose of this paper is to improve the bonding strength of tape-automated bonding (TAB) technology in supertwisted nematic liquid crystal display (STN LCD) module manufacturing by double-process control. First, the quality characteristic – the output of the process – is monitored by control charts and the variation of the process is reduced. Later, it is found that the quality characteristic is affected by critical input process parameters. These critical input process parameters and the quality characteristic are therefore monitored simultaneously. By this double-process control, the deviation of the process is further reduced. The results show that process capability and yield rate are increased.