| 模板对倒装焊焊点形态的影响及其可靠性研究 |
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| 引用本文： | 王玉鹏,周详.模板对倒装焊焊点形态的影响及其可靠性研究[J].中国集成电路,2009,18(2). |
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| 作者姓名： | 王玉鹏 周详 |
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| 作者单位： | 1. 南京信息职业技术学院机电学院南京210046
2. 苏州工业园区职业技术学院,江苏苏州21,5021 |
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| 摘 要： | 本文通过用于焊点形态预测软件SURFACE EVOLVER的输入数据文件,得到倒装焊焊点形态.参考模板开口指导说明(IPC-7525),拟定模板开口方案,得到相应的焊点形态.通过建立有限元模型,运用ANSYS软件对含铅焊点在热循环加载条件下的应力应变和疲劳寿命进行分析.根据预测得到的热疲劳寿命,找出了适合本文模型的模板结构参数,同时分析了其它设计与工艺参数和焊点可靠性之间的关系.
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| 关 键 词： | 倒装焊 模板 焊点形态 可靠性 热疲劳寿命 |
Impact of Stencil for Flip-Chip Shape and Their Reliability Study |
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| WANG Yu-peng,ZHOU Xiang.Impact of Stencil for Flip-Chip Shape and Their Reliability Study[J].China Integrated Circuit,2009,18(2). |
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| Authors: | WANG Yu-peng ZHOU Xiang |
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| Affiliation: | 1.Nanjing College of Information Technology;Nanjing;210046 China;2.Suzhou Industrial Park Institute of Vocational Technology;Jiangsu Suzhou;215021;China |
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| Abstract: | In the paper, solder joint shape is predicted through inputting data files to Surface Evolver software. Then the Flip-chip solder joints shape can be formed by the software. According to IPC-7525, the guidance for design stencil hatches, stencil hatch was carried out. After building the finite element model of solder joint, stress, strain and fatigue life analysis under thermal cycle condition were analyzed using ANSYS. Based on the thermal fatigue life attained by simulation, we can find out the right conf... |
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| Keywords: | Flip-chip stencil solder joint shape reliability thermal fatigue life |
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