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| 集成电路封装用环氧树脂模塑料性能影响因素研究 | |
| 引用本文： | 杨明山,单勇,李林楷,何杰.集成电路封装用环氧树脂模塑料性能影响因素研究[J].塑料工业,2007,35(2):5-9,16. |
| 作者姓名： | 杨明山 单勇 李林楷 何杰 |
| 作者单位： | 1. 北京石油化工学院材料科学与工程系,北京,102617 2. 云南非金属矿产研究所,云南,昆明,650218 3. 广东榕泰实业股份有限公司,广东,揭阳,522000 4. 北京化工大学材料科学与工程学院,北京,100029 |
| 摘 要： | 主要对集成电路封装用环氧树脂模塑料的性能影响因素进行了研究，采用硅微粉偶联剂处理、高速混合、双辊开炼、冷却粉碎、模压工艺路线，以高纯度邻甲酚醛环氧树脂为基体树脂，以硅微粉为填充剂，用正交实验法对集成电路封装用模塑料进行了配方优化，经过实验分析，获得了较优配方。考察了几个因素对环氧树脂模塑料性能的影响。结果表明，所制备的环氧模塑料性能达到了集成电路封装用模塑料的性能要求。端羧基液体丁腈橡胶对环氧树脂具有明显的增韧作用。 |
| 关 键 词： | 环氧模塑料 电子封装 正交实验 |
| 文章编号： | 1005-5770（2007）02-0005-05 |
| 修稿时间： | 2006-11-07 |
Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging |
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| YANG Ming-shan,SHAN Yong,LI Lin-kai,HE Jie.Study on Parameters Affecting Properties of Epoxy Molding Compound for Integrated Circuit Packaging[J].China Plastics Industry,2007,35(2):5-9,16. | |
| Authors: | YANG Ming-shan SHAN Yong LI Lin-kai HE Jie |
| Affiliation: | 1. Dept of Material Sci. and Eng., Beijing Institute of Petrochemical Technology, Beijing 102617, China; 2. Yunnan Research Institute of Nonmetal Mineral Materials, Kunming 650218, China; 3.Guangdong Rongtai Industry Co., Ltd., Jieyang 522000, China; 4. College of Material Sci. and Eng., Beijing University of Chemical Technology, Beijing 100029, China |
| Abstract: | The formulation and the process of the epoxy molding compound (EMC) for electronic packaging were studied. By means of the surface treatment by silane coupling agent, high speed premixing, twin roller mixing, cooled pulverizing and mould pressing, and taking ortho-cresol novolac epoxy (ECN) as matrix resin, silica powder as the filler, the formulation of the EMC for electronic packaging were optimized by means of orthogonal test, and the optimum formulation of EMC was obtained, and some parameters affecting the properties of the EMC were studied.The results showed the properties of the prepared EMC could meet the demands for the property of the EMC, and carboxyl-end butadiene- acrylonitrile copolymer(CTBN) had great toughening effect on EMC. |
| Keywords: | Epoxy Molding Compound Electronic Packaging Orthogonal Test |
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