| 高导电片状银包铜粉的制备技术研究 |
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| 引用本文： | 伍继君,朱晓云,郭忠诚,黄峰,李国明. 高导电片状银包铜粉的制备技术研究[J]. 电子元件与材料, 2006, 25(7): 39-42 |
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| 作者姓名： | 伍继君 朱晓云 郭忠诚 黄峰 李国明 |
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| 作者单位： | 昆明理工大学材料与冶金工程学院,云南,昆明,650093;昆明理工恒达科技有限公司,云南,昆明,650167 |
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| 基金项目： | 科技部科技型中小企业技术创新项目 |
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| 摘 要： | 采用[Ag(NH3)]+溶液对片状铜粉进行包覆,研究了铜粉粒径、[Ag(NH3)]+溶液浓度、包覆温度、分散剂含量等因素对银包铜粉银含量和电阻率等的影响。结果表明:通过控制包覆温度(60℃)、银氨络离子浓度(0.8mol·L–1)以及分散剂含量(1.0g·L–1),得到了电阻率为0.8×10–3?·cm的银包铜粉。XRD分析表明,该银包铜粉只有Ag和Cu相,不含中间产物。银包铜粉松装密度为0.50g·cm–3左右,比表面积为3.1~3.3m2·g–1。
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| 关 键 词： | 复合材料 导电性 片状银包铜粉 包覆温度 分散剂 |
| 文章编号： | 1001-2028（2006）07-0039-04 |
| 收稿时间： | 2006-01-29 |
| 修稿时间： | 2006-01-29 |
Preparation and Research of High Conduction of Silver Covered Copper Powder |
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| WU Ji-jun,ZHU Xiao-yun,GUO Zhong-cheng,HUANG Feng,LI Guo-ming. Preparation and Research of High Conduction of Silver Covered Copper Powder[J]. Electronic Components & Materials, 2006, 25(7): 39-42 |
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| Authors: | WU Ji-jun ZHU Xiao-yun GUO Zhong-cheng HUANG Feng LI Guo-ming |
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| Abstract: | A flake silver covered copper powder was studied with [Ag(NH3)]+ solution. The effects of particle size of copper powder, concentration of [Ag(NH3)]+, covered temperature and content of dispersant on the content of silver and resistivity were researched. The resistivity (0.8×10–3 ?·cm) of flake silver covered copper powder was obtained by controlling covered temperature (60℃), concentration of [Ag(NH3)]+ (0.8 mol·L–1) and content of dispersant (1.0 g·L–1). Only silver phase and copper phase are found in XRD spectra, which show that there are no interim-production in the sheet silver covered copper powder. The loose density of flake silver covered copper powder is approximately 0.50 g·cm–3, and the specific surface area of is 3.1~3.3 m2·g–1. |
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| Keywords: | composite conductivity flake silver covered copper powder covered temperature dispersant |
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