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| 倒装芯片焊点可靠性的有限元模拟法探讨 | |
| 引用本文： | 肖小清,何小琦,恩云飞,周继承. 倒装芯片焊点可靠性的有限元模拟法探讨[J]. 电子工艺技术, 2006, 27(4): 201-204 |
| 作者姓名： | 肖小清 何小琦 恩云飞 周继承 |
| 作者单位： | 1. 信息产业部电子第五研究所,广东,广州,510610;中南大学,湖南,长沙,410083 2. 信息产业部电子第五研究所,广东,广州,510610 3. 中南大学,湖南,长沙,410083 |
| 摘 要： | 随着集成电路封装技术的发展,倒装芯片技术得到广泛应用.由于材料的热膨胀失配,使倒装焊点成为芯片封装中失效率最高的部位,而利用快捷又极具参考价值的有限元模拟法是研究焊点可靠性的重要手段之一.简单介绍了集成电路芯片焊点可靠性分析的有限元模拟法,重点概括了利用该方法对芯片焊点进行可靠性评价常见的材料性质和疲劳寿命预测模型. |
| 关 键 词： | 可靠性 有限元 热循环 应力/应变 疲劳寿命模型 |
| 文章编号： | 1001-3474（2006）04-0201-04 |
| 收稿时间： | 2006-05-14 |
| 修稿时间： | 2006-05-14 |
Finite Element Analysis for Flip Chip Solder Joint Reliability |
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| XIAO Xiao-qing,HE Xiao-qi,EN Yun-fei,ZHOU Ji-chen. Finite Element Analysis for Flip Chip Solder Joint Reliability[J]. Electronics Process Technology, 2006, 27(4): 201-204 | |
| Authors: | XIAO Xiao-qing HE Xiao-qi EN Yun-fei ZHOU Ji-chen |
| Affiliation: | 1. No. 5 Research Institute of Ministry of Information Industry, Guangzhou 510610, China; 2. Central South University, Changsha 410083 ,China |
| Abstract: | As IC packaging technology developing,flip chip is widely used.Because of the coeffecient thermal efficent mismatch of material,the flip chip solder joint become the crispest position.And the swift,dependent finite element simulation is one of the practical means.The finite element simulation is introduced.Also there are some discusses about material behavior and fatigue model in solder joint life prediction. |
| Keywords: | Reliability Finite element Thermal cycling Stress/strain Fatigue life model |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |