UV-nanoimprinting using non-transparent molds and non-transparent substrates |
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Authors: | R. Kirchner A. FinnL. Teng M. PloetnerA. Jahn L. NueskeW.-J. Fischer |
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Affiliation: | a Institute of Semiconductor and Microsystems Technology, Technische Universitaet Dresden, 01062 Dresden, Germany b Fraunhofer-Institute for Photonic Microsystems, Maria-Reiche-Strasse 2, 01109 Dresden, Germany |
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Abstract: | A new ultraviolet assisted nanoimprint lithography technique with an exposure through non-transparent molds and a nm-resolution capability is reported. The UV imprint material was not cured by direct irradiation, but substantially exposed to indirect and diffuse irradiation. The nanoimprint molds consisted of a transparent support and a non-transparent, patterned element. Successful imprints were conducted on transparent glass and polymer foils placed on non-transparent substrate holders as well as on SiO2 on Si. The reported technique enables the application of non-transparent mold materials like Si, new mold materials and alternative antisticking layers like metals in UV-NIL. |
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Keywords: | UV nanoimprint Non-transparent mold Opaque mold NT-UV-NIL Antisticking layer |
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