a IMEC VZW, Kapeldreef 75, B-3001 Leuven, Belgium b EE Department, K.U. Leuven, Kasteelpark Arenberg 10, Leuven B-3001, Belgium
Abstract:
In this paper we will highlight key integration issues that were encountered during the development of the 3D-stacked IC Through Silicon Via (TSV) module and present solutions to achieve a robust copper TSV. Electrical performance of the obtained TSV module is discussed based on a lumped RC model for 3D ring oscillators containing TSVs between bottom and top tiers.