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Surface activation using oxygen and nitrogen radical for Ge-Si Avalanche photodiode integration
Authors:Ki Yeol Byun  Isabelle FerainJohn Hayes  Ran Yu  Farzan Gity  Cindy Colinge
Affiliation:a Tyndall National Institute, University College Cork, Lee Maltings, Prospect Row, Cork, Ireland
b Department of Microelectronics, University College Cork, Cork, Ireland
c Department of Electrical and Electronics Engineering, University College Cork, Cork, Ireland
Abstract:In this work, an alternative method for producing the single crystalline Ge-Si Avalanche photodiodes (APD) with low thermal budget was investigated. Structural and electrical investigations show that low temperature Ge to Si wafer bonding can be used to achieve successful APD integration. Based on the surface chemistry of the Ge layer, the buried interfaces were investigated using high resolution transmission electron microscopy as a function of surface activation after low temperature annealing at 200 and 300 °C. The hetero-interface was characterized by measuring forward and reverse currents.
Keywords:Surface activation  Ge to Si wafer bonding  Avalanche photodiodes
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