| 基于Moldex3D的IC封装模CAE建模方法 |
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| 引用本文： | 唐佳,曹阳根.基于Moldex3D的IC封装模CAE建模方法[J].上海工程技术大学学报,2010,24(3):253-256. |
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| 作者姓名： | 唐佳 曹阳根 |
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| 作者单位： | [1]上海工程技术大学工程实训中心,上海201620 [2]上海工程技术大学材料工程学院,上海201620 |
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| 基金项目： | 上海市教委科研创新资助项目 |
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| 摘 要： | 以SSOP-20L集成电路塑封为例,运用Moldex3D软件建立CAE模型.用此方法建立的CAE模型与物理模型具有较好的相似性,可作为IC塑封模拟金线变形和芯片偏移的基础模型,并可预见塑封过程中可能发生的问题,为模具浇注系统的设计提供可靠依据.
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| 关 键 词： | Moldex3D IC封装 塑料封装模具 |
CAE Modeling of IC-Packaging Mould Based on Moldex3D |
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| TANG Jia,CAO Yang-gen.CAE Modeling of IC-Packaging Mould Based on Moldex3D[J].Journal of Shanghai University of Engineering Science,2010,24(3):253-256. |
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| Authors: | TANG Jia CAO Yang-gen |
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| Affiliation: | b(a.Engineering Training Center;b.College of Materials Engineering,Shanghai University of Engineering Science,Shanghai 201600,China) |
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| Abstract: | Takeing plastic encapsulation of SSOP-20L as an example,a CAE model was built based on Moldex3D software.The CAE model established by the method presented a good similarity with the entity,which can be used as a base model for simulating plastic deformation and chip offset,forecasting problems occurred in the process of packaging and providing reliable references for casting model designs. |
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| Keywords: | Moldex3D IC-packaging plastic package mould |
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