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用DSC法研究环氧树脂/环氧封端酚酞聚芳醚腈的固化特性
引用本文:徐刚.用DSC法研究环氧树脂/环氧封端酚酞聚芳醚腈的固化特性[J].中国胶粘剂,2000,9(3):24-26.
作者姓名:徐刚
作者单位:江西师范大学,化学系,江西南昌,330027
基金项目:国家自然科学基金,江西省青年科学金
摘    要:利用差示扫描量热法研究了AG - 80环氧树脂和环氧封端酚酞聚芳醚腈 (简称E -PCE)共混物中固化剂含量对树脂基体固化反应温度、反应热的影响。此共混环氧树脂基体的最低固化反应温度为1 61 .3℃ ,固化反应表观活化能为 60 .66kJ/mol,固化反应级数为 0 .875。

关 键 词:环氧树脂  E-PCE  差示扫描量热法  固化反应  反应动力学

Study on Curing Characteristics of Epoxy Resin/Epoxy Terminated Phenolphthalein Poly (Cyanoarylether) Blends Using Differential Scanning Calorimetry
Xu Gang.Study on Curing Characteristics of Epoxy Resin/Epoxy Terminated Phenolphthalein Poly (Cyanoarylether) Blends Using Differential Scanning Calorimetry[J].China Adhesives,2000,9(3):24-26.
Authors:Xu Gang
Abstract:The effect of curing agent DDS contain in AG-80/E-PCE blend epoxy resin matrix on temperature and heat of the curing reaction were studied by means of differential scanning calorimetry(DSC). The kinetic parameters of the curing reaction were obtained, with lowest curing reaction temperature 161.3℃, the apparent activation energy 60.66kJ/mol, and the curing reaction order 0.875.
Keywords:epoxy resin  E-PCE  differential scanning calorimetry  curing reaction  kinetics of curing reaction
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