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Etch characteristics of magnetic tunnel junction stack with nanometer-sized patterns for magnetic random access memory
Authors:Su Ryun Min  Kee Won Kim  Sung-Hoon Choa
Affiliation:a Department of Chemical Engineering, Inha University, 253 Yonghyun-Dong, Nam-Gu, Incheon 402-751, Republic of Korea
b Semiconductor Device and Material lab, Samsung Advanced Institute of Technology, Mt. 14-1, Nongseo-dong, Giheung-gu, Yongin, Gyeonggi-do 446-712, Republic of Korea
Abstract:Etch characteristics of magnetic tunnel junction (MTJ) stack masked with TiN films were investigated using an inductively coupled plasma reactive ion etcher in Cl2/Ar and BCl3/Ar gases for magnetic random access memory. The effect of etch gas on the etch profile of MTJ stacks was examined. As Cl2 and BCl3 concentrations increased, the etch slope of etched MTJ stack became slanted and the dimensional shrinkage was observed. A high degree of anisotropic etching of MTJ stacks was achieved using Cl2/Ar gas at the optimized etch conditions.
Keywords:Magnetic random access memory  MTJ stack  Inductively coupled plasma reactive ion etching  Cl2/Ar  BCl3/Ar
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