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Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders |
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| Authors: | RS Sidhu N Chawla |
| Affiliation: | (1) School of Materials, Fulton School of Engineering, Arizona State University, Tempe, USA;(2) Present address: Assembly Technology Development, Intel Corporation, Chandler, AZ 85226, USA;(3) School of Materials and Department of Aerospace Engineering, Arizona State University, Tempe, AZ 85287-8706, USA |
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