| 基于磁控溅射技术的电磁屏蔽层研究 |
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| 引用本文： | 杜元甲,董树荣,邵净羽.基于磁控溅射技术的电磁屏蔽层研究[J].表面技术,2006,35(4):75-76,81. |
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| 作者姓名： | 杜元甲 董树荣 邵净羽 |
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| 作者单位： | 浙江大学信息学院,浙江,杭州,310027;浙江大学信息学院,浙江,杭州,310027;浙江大学信息学院,浙江,杭州,310027 |
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| 摘 要： | 为了解决电子系统塑料机盒的抗EMI问题,提出了一种采用多靶磁控溅射技术对塑料内表面进行金属化的新环保工艺,利用屏蔽效能对电磁兼容性作了理论分析,并对金属化层的膜系结构、溅射工艺、附着强度等作了较为深入的研究.研究结果表明:衰减损耗是各层屏蔽效果线性相加的结果;反射损耗与各层相对位置关系无关;层数多或各屏蔽层的反射越大,则屏蔽效果越好.试验表明:采用Cu/1Cr18Ni9Ti的金属屏蔽层结构,可以获得良好的屏蔽效能及耐候性,其中500nm Cu 100nm 1Cr18Ni9Ti较宜.
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| 关 键 词： | 电磁屏蔽 塑料 磁控溅射 屏蔽效能 |
| 文章编号： | 1001-3660（2006）04-0075-02 |
| 收稿时间： | 2006-02-09 |
| 修稿时间： | 2006-02-09 |
Study on Anti-EMI Metal Films by Magnetic Sputtering |
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| DU Yuan-jia,DONG Shu-rong,SHAO Jing-yu.Study on Anti-EMI Metal Films by Magnetic Sputtering[J].Surface Technology,2006,35(4):75-76,81. |
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| Authors: | DU Yuan-jia DONG Shu-rong SHAO Jing-yu |
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| Abstract: | Aimed at the clean solution of anti-EMI technology of plastic shell of electronic equipment,a method is presented,which is named as magnetic sputtering.The shielding efficiency and its shielding mechanism of different metals and its different structures are studied by electric and magnetic theory expressions.The technology parameter of sputtering is also studied.The result shows that the shielding metal films loss is the linear plus results of each film.The reflection is independent of position of each shielding film.The more layers or reflection between films,the more shielding efficiency can be obtained.The experiment results show that the optimal structure of shielding films is 500nm Cu+100nm 1Cr18Ni9Ti. |
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| Keywords: | Anti-EMI Plastic Magnetic sputtering Shielding efficiency |
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