| 无卤／无铅积层板B^2it^TM |
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| 引用本文： | 蔡积庆.无卤／无铅积层板B^2it^TM[J].印制电路信息,2003,23(9):52-57. |
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| 作者姓名： | 蔡积庆 |
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| 作者单位： | 南京无线电八厂 |
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| 摘 要： | 概述了应用新芯印刷工艺和一次性层压工艺的无卤/无Pb积层板B2itTM三种制造工艺,评价了无卤/无Pb积层 板B2itTM的长期可靠性和无Pb再流焊特性。
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| 关 键 词： | 无卤/无Pb 积层板B2itTM 新芯印刷工艺一次性层压工艺 |
Halogen Free/Pb Free Build-up Board B2itTM |
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| Cai Jiqing.Halogen Free/Pb Free Build-up Board B2itTM[J].Printed Circuit Information,2003,23(9):52-57. |
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| Authors: | Cai Jiqing |
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| Abstract: | This paper summarizes three types manufacturing process of halogen free/Pb free build-up board B2it?using new core printing process and single step press process,evaluating long term reliability and Pb free reflow characteritics of halogen free/Pb free build-up board B2it? |
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| Keywords: | Halogen free/Pb free build-up board B2it? new core printing process single step press process |
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