| 厚铜芯板及高胶含量叠层结构压合方法的研究 |
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| 引用本文： | 黄镇.厚铜芯板及高胶含量叠层结构压合方法的研究[J].印制电路信息,2010(Z1):374-382. |
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| 作者姓名： | 黄镇 |
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| 作者单位： | 天津普林电路股份有限公司 |
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| 摘 要： | 文章以一典型厚铜芯板、高胶含量叠层结构的在线PCB产品的层压实验为主线,较详细的介绍了不同压机、压合程式及叠层结构对此特殊结构压合质量的影响,并最终通过实际实验结果分析得出较适用于厚铜芯板高胶含量结构的压合方法,为改善厚铜芯板压合褶皱、板厚不均等问题等提供了很好的指导意义。
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| 关 键 词： | 厚铜芯板 高胶含量 多层压合 褶皱 |
Thick copper core and high resin content pressing structure study |
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| HUANG Zhen.Thick copper core and high resin content pressing structure study[J].Printed Circuit Information,2010(Z1):374-382. |
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| Authors: | HUANG Zhen |
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| Abstract: | This article is based upon a typical multilayer press experiment of an inline PCB production,which is with thick copper inner board and high resin content lamination structure.It particular introduced the influence of different lamination equipment,lamination process and different lamination structure for this special structure.And finally base on the analysis of actual experiment,it raised some proposal which is more suitable for the lamination of the special structure,provided good guidance significance t... |
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| Keywords: | Thick copper inner board High Resin content Multilayer pressing Pressing drape |
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