用于MEMS器件芯片级封装的金-硅键合技术研究

MEMS器件大都含有可动的硅结构 ,在器件加工过程中 ,特别是在封装过程中极易受损 ,大大影响器件的成品率。如果能在MEMS器件可动结构完成以后 ,加上一层封盖保护 ,可以显著提高器件的成品率和可靠性。本文提出了一种用于MEMS芯片封盖保护的金 硅键合新结构 ,实验证明此方法简单实用 ,效果良好。该技术与器件制造工艺兼容 ,键合温度低 ,有足够的键合强度 ,不损坏器件结构 ,实现了MEMS器件的芯片级封装。我们已经将此技术成功地应用于射流陀螺的制造工艺中

Investigation on Au-Si wafer bonding for MEMS device packaging

Most MEMS devices, i.e. accelerometer, micro gyroscope, have movable silicon structures, which are fragile and easily damaged in the fabrication process of devices,so that the yield will be decreased greatly. However, the yield and reliability can be increased if a layer of encapsulation is designed to protect the movable structures of MEMS devices. In this paper we design a new structure of Au Si wafer bonding for MEMS device packaging, it is proved that the process is simple and the result is satisfied. This technique is compatible with regular MEMS devices fabrication process, achieves adequate intensity, will not damage the micro mechanical structures, its bonding temperature is lower and can realize wafer level packaging of the MEMS device. It has been already used in the fabrication of micro gyroscope successfully.